Equipment for Electronic Products Manufacturing (Chinese), pp. 1-5, February 2009.

Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages

L. Nie, M. Osterman, and M. Pecht
Center for Advanced Life Cycle Engineering (CALCE)
University of Maryland
College Park, MD

F. Song, J. Lo, and S.K. Lee
Electronic Packaging Laboratory Center for Advanced Microsystems Packaging
Hong Kong University of Science & Technology Clear Water Bay
Kowloon, Hong Kong


In recent years, many countries banned the use of lead in select high volume electronic equipment. However, exemptions from lead-free legislation have been granted for certain products. These equipment manufacturers with exemption are facing dwindling supply of lead based parts for their products, and they are looking at reballing lead-free ball grid array packages with tin-lead solder balls. While reballing has been used for part reclamation, very little information is available on reliability of reballed parts. Two ball removal and two ball attachment techniques were used to change lead-free BGAs in to tin-lead BGAs, in order to determine the effect of different reballing process to the quality of reballed BGAs. Solder attach strength is used to examine the reballing process. The impact of isothermal aging is also examined.

Keywords: Ball Grid Array Package; Reballing; Cold Bump Pull Test

Complete article is available to CALCE Consortium Members.


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