Journal of Electronic Materials, Vol. 38, No. 6, 2009, pp. 815-827

An Assessment of Immersion Silver Surface Finish
for Lead-Free Electronics

Weiqiang Wang1, Anupam Choubey1, Michael H. Azarian1 and Michael Pecht1,2
1.Center for Advanced Life Cycle Engineering (CALCE),
University of Maryland,
College Park, MD 20742, USA

2.City University of Hong Kong,
Kowloon, Hong Kong


The worldwide transition to lead-free electronics has increased the usage of several lead-free pad finishes for electronic assembly manufacturers, including immersion silver, immersion tin, electroless nickel-immersion gold, and organic solderability preservatives. This study assesses and compares immersion silver as a circuit board finish in terms of its ease of use, wettability, solderability, shelf life, appearance, solder joint strength, intermetallic and void formation, reliability, and costs.

Keywords: Immersion silver, surface finish, lead-free, circuit board

Complete article available to CALCE consortium members

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