International Sustainable Development Research Society 2009

Life-Stress Relationship for Thin Film Transistor Gate Line Interconnects on Flexible Substrates

Thomas Martin1 and Aris Christou1
1CALCE, Center for Advanced Life Cycle Engineering, Department of Mechanical Engineering, University of Maryland, College Park, Maryland 20740, USA


Flat panel displays have been in commercial use for decades. In recent years, there has been a tremendous push to manufacture displays on flexible substrates. The cross section in Fig.1 shows an active matrix array that is comprised of an array of thin film transistors fabricated on a flexible substrate. Making displays flexible have created numerous failure mechanisms [1]. We report on the effect of mechanical stresses, imposed on the transistor gate interconnect lines during cyclic bending of the substrate, on the reliability of thin film transistors on flexible substrates. The evolution of stresses during cyclical substrate bending and its effect on interconnect electrical degradation has been determined.

This article is available to CALCE Consortium Members for personal review.

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