Thomas Martin1 and Aris Christou1
1CALCE, Center for Advanced Life Cycle Engineering, Department of Mechanical Engineering, University of Maryland, College Park, Maryland 20740, USA
Abstract:
Flat panel displays have been in commercial use for decades. In recent years, there has been a
tremendous push to manufacture displays on flexible substrates. The cross section in Fig.1 shows
an active matrix array that is comprised of an array of thin film transistors fabricated on a flexible
substrate. Making displays flexible have created numerous failure mechanisms [1]. We report on
the effect of mechanical stresses, imposed on the transistor gate interconnect lines during cyclic
bending of the substrate, on the reliability of thin film transistors on flexible substrates. The
evolution of stresses during cyclical substrate bending and its effect on interconnect electrical
degradation has been determined.