Solder Ball Attachment Assessment of Reballed...

APEX 2008, Las Vegas, Nevada, March 30th – April 3rd, 2008.

Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages

SLei Nie, Michael Osterman and Michael Pecht
Center for Advanced Life Cycle Engineering (CALCE)
University of Maryland
College Park, MD

Fubin Song, Jeffrey Lo and S.W. Ricky Lee
Electronic Packaging Laboratory
Center for Advanced Microsystems Packaging
Hong Kong University of Science & Technology
Clear Water Bay, Kowloon, Hong Kong Abstract
In recent years, many countries banned the use of lead in select high volume electronic equipment. As a result, high reliability low volume equipment manufacturers are facing dwindling supply of lead based parts for their products. With the uncertainty associated with lead-free reliability and the issues associated with mixing lead-free solder with tin-lead solder, equipment manufactures are looking at reballing lead-free ball grid array packages with tin-lead solder balls. While reballing has been used for part reclamation, very little information is available on reliability of reballed parts. This paper presents lead-free ball grid array (BGA) packages subjected to two ball removal and two ball attachment techniques. Solder attach strength is used a metric to examine the reballing process. The impact of isothermal aging is also examined.

Complete article is available to CALCE Consortium Members.