APEX 2008, Las Vegas, Nevada, March 30th – April
3rd, 2008.
Solder Ball Attachment Assessment of Reballed Plastic Ball
Grid Array Packages
SLei Nie, Michael Osterman and Michael Pecht
Center for Advanced Life Cycle Engineering (CALCE)
University of Maryland
College Park, MD
Fubin Song, Jeffrey Lo and S.W. Ricky Lee
Electronic Packaging Laboratory
Center for Advanced Microsystems Packaging
Hong Kong University of Science & Technology
Clear Water Bay, Kowloon, Hong Kong
Abstract
In recent years, many countries banned the use of lead in
select high volume electronic equipment. As a result, high
reliability low volume equipment manufacturers are facing dwindling
supply of lead based parts for their products. With the
uncertainty associated with lead-free reliability and the issues
associated with mixing lead-free solder with tin-lead solder, equipment
manufactures are looking at reballing lead-free ball grid array
packages with tin-lead solder balls. While reballing has been
used for part reclamation, very little information is available on
reliability of reballed parts. This paper presents lead-free
ball grid array (BGA) packages subjected to two ball removal and two
ball attachment techniques. Solder attach strength is used a
metric to examine the reballing process. The impact of
isothermal aging is also examined.
Complete
article is available to CALCE Consortium Members.
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