Microelectronics Reliability, Vol. 48, pp. 1033–1039, 2008

Pressure-induced Tin Whisker Formation

Tadahiro Shibutani
Qiang Yu
Masaki Shiratori
Yokohama National University
79-5 Tokiwadai, Hodogaya, Yokohama
240-8501 Kanagawa, Japan

Michael Pecht
Center for Advanced Life Cycle Engineering (CALCE)
University of Maryland
College Park, Maryland, USA


This paper presents a fundamental assessment of pressure-induced tin whisker formation. A creep-based tin whisker model was developed to explain experimental data as well as data from industrial studies. A grain boundary diffusion model was then developed to predict a maximum whisker length. It is shown that creep properties obtained from samples can be used to screen plating finishes susceptible to tin whiskering. This enables a manufacturer to assess tin whisker risks prior to volume production.

Complete article is available to CALCE Consortium Members.

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