Proceeding for 62nd Meeting of the Society for Machinery Failure Prevention Technology (MFPT), Virginia Beach, VA, May 2008


Jie Gu
Donald Barker
Michael Pecht
Prognostics and Health Management Laboratory
Center for Advanced Life Cycle Engineering (CALCE)
University of Maryland
College Park, MD 20742, USA


This paper discusses a prognostics methodology for assessing the remaining life of a group of electronic components mounted on a circuit board using a single accelerometer to monitor the life-cycle vibration loads. The accelerometer captures the global circuit board response to enable all components on the circuit board to be analyzed. A case study is presented using a single accelerometer mounted on an electronic circuit board that is subject to random vibration. The acceleration data is converted into local circuit board strain near the various components through modal analysis, and further converted into component solder joint stress by finite element analysis for the final damage assessment. The paper then compares the failure prognostic results to experimentally measured component lives through real time daisy-chain resistance measurements.

Index Terms: Accelerometer, electronics, prognostics, vibration

Complete article is available to CALCE PHM Consortium Members.

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