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<title>Nonlinear Stress Modeling Scheme to
Analyze Semiconductor Packages
Subjected to Combined Thermal and
Hygroscopic Loading</title></head>
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<center><i>Journal of Electronic Packaging, June 2008, Vol. 130, pp. 024502-1 - 024502-5</i>

<br><h2>Nonlinear Stress Modeling Scheme to
Analyze Semiconductor Packages
Subjected to Combined Thermal and
Hygroscopic Loading</h2>
<br><br><b>Samson Yoon</b><br>
<b>Changsoo Jang</b><br>
<b>Bongtae Han, <i>Fellow, ASME</i></b><br>
Center for Advanced Life Cycle Engineering (CALCE)<br>
Department of Mechanical Engineering<br>
University of Maryland<br>
College Park, MD 20742<br>
 

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<b>Abstract:</b>

<p>A nonlinear finite element modeling (FEM) scheme to analyze the
combined effect of thermal and hygroscopic deformation is presented.
The scheme employs the conventional moisture diffusion,
heat transfer, and stress analysis routines available in the commercial
FEM package, but offers a unique way of linking the
routines to conduct a nonlinear stress analysis of semiconductor
packages subjected to moisture as well as temperature excursions.
Strategies to implement the proposed scheme using commercial
finite element analysis softwares are discussed. The numerical accuracy
of the scheme is confirmed with the analytical solution
of elastic/viscoelastic composite cylinder subjected to the combined
loading of thermal expansion and hygroscopic swelling.
</p>



<p><a href="../../fulltext/2008/2008jep-Nonlinear_stress_modeling.pdf">Complete article</a> is available to CALCE Consortium Members.</p>



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