Journal of Adhesion Science & Technology, Volume 22, Numbers 8-9, pp. 871-892, 2008.

Anisotropic Conductive Adhesives for Flip-chip Interconnections

Weiqiang Wang, Y.C. Chan, and Michael Pecht
CALCE, Center for Advanced Life Cycle Engineering
Department of Mechanical Engineering,
University of Maryland,
College Park, Maryland 20740, USA

Anisotropic conductive adhesive films consist of an epoxy adhesive with dispersed conductive particles. They are used as electrical-mechanical interconnecting materials for flip-chip to flexible substrates and flip-chip to glass substrates. Contact resistance and adhesion strength are two important features of anisotropic conductive adhesive film joints. Contact resistance is affected by the curing degree of the adhesive, the bump characteristics, the reflow process and the environmental application conditions. Adhesion strength is affected by bonding temperature, bonding pressure, bubbles in the joints and particle characteristics. To assess reliability, anisotropic conductive adhesive film joints were tested under thermal cycling tests, autoclave tests and mechanical shock tests.

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