Journal of Electronic Packaging, Vol. 130, 2008 pp. 011004-1 - 011004-8

Advanced Thermal-Moisture Analogy Scheme for An-isothermal Moisture Diffusion Problem

Changsoo Jang
Seungbae Park
Mechanical Engineering,
State University of New York at Binghamton,
Binghamton, NY 13902-6000

Bongtae Han Fellow, ASME
Samson Yoon
Mechanical Engineering
University of Maryland
College Park, MD 20742

We propose an advanced thermal-moisture analogy scheme to cope with the inherent limitations of the existing analogy schemes. The new scheme is based on the experimentally observed unique hygroscopic behaviour of polymeric materials used in microelectronics; i.e., the saturated concentration is only a function of relative humidity regardless of temperature. A new analogy formulation based on the modified solubility is presented and the scheme is implemented to investigate its accuracy and applicability. The results from a simple case study corroborate that the advanced scheme can be used effectively for package assemblies subjected to general an-isothermal loading conditions.

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