H. Qi, Q. Zhang, and E. Tinsley
Round Rock, TX
M. Osterman and M Pecht
University of Maryland
College Park, MD 20742
In this study, a comprehensive experimental and numerical approach was used to investigate high cycle cyclic torsion fatigue behavior of lead-free solder joints in a plastic ball grid array (PBGA) package. The test vehicle was a commercial laptop motherboard. The motherboard was subjected to torsional loading and life tests were conducted. Using finite element analysis (FEA), the test assembly was simulated as a global model and the BGA component was simulated as a local model. Strains measured on the motherboard surface near by the BGA were used to calibrate the FEA models. By combining the life test results and FEA simulations, a high cycle fatigue model for the lead-free solder joints was generated based on the Coffin¨CManson strain-range fatigue damage model. This model can now be used to predict the cycles to failure of BGA interconnects for new electronic product design under cyclic torsion loading.
Index Terms - Finite element analysis (FEA), lead-free solder joints, plastic ball grid array (PBGA).
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