Sony Mathew, Michael Osterman, and Michael Pecht
University of Maryland
College Park, MD 20742
Tadahiro Shibutani and Qiang Yu
Yokohama National University
Yokohama, Japan 240-8501
The selection of lead-free tin based surface finishes resulting from government regulation of lead has reintroduced, into the spotlight, the reliability concern due to the possible formation of electrically conductive tin whiskers. This paper reviews risk mitigation studies including use of tin alloys, conformal coating, electroplating techniques, surface treatment, annealing, and use of under-layer material. This paper also discusses approaches to manage the risk due to tin whiskers.
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