Proceedings of the International Symposium on High Density Packaging and Microsystem Integration, pp.1-8, Shanghai, China, June 26-28 2007

Tin Whiskers: How to Manage and Mitigate the Risks

Sony Mathew, Michael Osterman, and Michael Pecht
University of Maryland
College Park, MD 20742

Tadahiro Shibutani and Qiang Yu
Yokohama National University
Yokohama, Japan 240-8501


The selection of lead-free tin based surface finishes resulting from government regulation of lead has reintroduced, into the spotlight, the reliability concern due to the possible formation of electrically conductive tin whiskers. This paper reviews risk mitigation studies including use of tin alloys, conformal coating, electroplating techniques, surface treatment, annealing, and use of under-layer material. This paper also discusses approaches to manage the risk due to tin whiskers.

Complete article is available to CALCE Consortium Members.


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