IEEE Transactions on Electronics Packaging Manufacturing, 2007.

Design of Experiments for Board Level Solder Joint Reliability of PBGA Package under Various Manufacturing and Multiple Environmental Loading Conditions

H. Qi
Dell, Inc.
Round Rock, TX

M. Osterman and M. Pecht
University of Maryland
College Park, MD 20742


A design of experiments was conducted to determine the reliability of plastic ball grid array packages under various manufacturing and multiple environmental loading conditions. Parameters included conformal coating methods, underfill, solder mask defined and non-solder mask defined pads. Board level temperature cycling, vibration, and combined temperature cycling and vibration testing were performed to quantify the reliability and identify preferred design parameters.

Through the main effects and interaction analysis, test results show underfill is the key parameter related to the solder joint reliability improvement. Conformal coat method and printed circuit board pad design are not main effects on solder joint reliability. No interactive relationship exists among these three factors under temperature cycling loading, but some interactive relationship between printed circuit board pad type and the conformal coating method exists under vibration and combined loading conditions.

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