2007 Electronic Components and Technology Conference, Reno, Nevada, pp. 407-414, May 29-June 1, 2007

Reliability Assessment on Insertion Mount Assembly under Vibration Conditions

H. Qi
Dell Inc.
Round Rock, TX

S. Ganesan
Intel Corporation
Chandler, AZ 85226

G. Plaza, M. Osterman, and M Pecht
University of Maryland
College Park, MD 20742


This paper presents the reliability design-of-experiment and results for an insertion-mount assembly under random vibration loading conditions. The natural frequency and overstress limits were first identified for the test vehicle. The durability of assemblies with Sn37Pb (SnPb) and Sn3.OAgO.5Cu (SAC) solder joints was compared under aging conditions that vary on temperature and duration: 125oC for 100 hours, 125oC for 350 hours, -55oC for 1000 hours. The effects of aging and printed circuit board pad finishes on solder joint reliability were also investigated. The results show that SnPb solder joints have better performance than SAC solder joints, especially under high-vibration loading conditions and with thermal aging treatment. Pad finishes were also found to contribute to diffusion in assembly reliability but with different trends for differently aged products.

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