Microelectronics Reliability, Vol. 47, Issue 12, pp. 1849-1856, Dec. 2007
J. Gu, D. Barker, and M. Pecht
University of Maryland
College Park, MD 20742
In this paper, a methodology is developed for monitoring, recording, and analyzing the life-cycle vibration loads for remaining-life prognostics of electronics. The responses of printed circuit boards to vibration loading in terms of bending curvature are monitored using strain gauges. An analytical model calibrated by finite element analysis is developed to calculate the strain at interconnects using the measured response. The interconnect strain values are then used in a vibration failure fatigue model for damage assessment. Damage estimates are accumulated using Miner's rule after every mission and then used to predict the life consumed and remaining-life. The methodology has been demonstrated for remaining-life prognostics of a printed circuit board. The result has also been verified by the real-time to failure of the components by checking the components' resistance data.
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