H. Qi and N. Vichare
Round Rock, TX
M. Azarian and M. Pecht
University of Maryland
College Park, MD 20742
The specification of a failure criterion for solder joints is an important element in the qualification of an electronic product. A common approach to reliability testing is to monitor electrical resistance during the testing. The techniques employed for resistance monitoring and data acquisition will determine whether information regarding transients or long-term drift is captured by the measurement. This paper reviews and assesses the failure criteria used in industry and academia, focusing on three key attributes: resistance threshold, duration of resistance change, and frequency of changes. An experimental study on thermomechanical fatigue of BGA solder joints was performed to compare measurement techniques and failure criteria.
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