Peter Sandborn and Rifat Jafreen
CALCE, Department of Mechanical Engineering
University of Maryland
College Park, MD 20742
This paper describes a cost model developed to assess the cost ramifications of the transition from tinlead to lead-free electronic parts. All tin-lead, all lead-free and mixed assembly approaches are considered. The model makes basic assumptions of a fixed generic set of applications, incorporates a cost of plan development, and includes the costs of reprocessing tin lead to lead free and vice versa. In addition, the model takes into consideration the cost of money and assumptions about tin-lead and lead-free part available over time. Reliability impacts of the lead-free transition are cost modeled as changes to the number of required spares.
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