T. Fang, S. Mathew, M. Osterman, and Michael Pecht
University of Maryland
College Park, MD 20742
In response to legislation mandating the manufacture of lead-free electronics, part manufacturers have adopted pure-tin and high-tin lead-free alloy finishes. The drawback of lead-free tin finish is tin whisker formation. This article presents methodology and software developed to assess tin whisker failure risk over time.
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