SMT Magazine, PennWell, Vol. 20, No.5, pp 24-25, May 2006

Assessing Tin Whisker Risk in Electronic Products

T. Fang, S. Mathew, M. Osterman, and Michael Pecht
University of Maryland
College Park, MD 20742


In response to legislation mandating the manufacture of lead-free electronics, part manufacturers have adopted pure-tin and high-tin lead-free alloy finishes. The drawback of lead-free tin finish is tin whisker formation. This article presents methodology and software developed to assess tin whisker failure risk over time.

Complete article is available to CALCE Consortium Members.


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