P. Sandborn, J. Myers, T. Barron, and M. McCarthy
CALCE EPSC
University of Maryland
College Park, MD 20742
Abstract:
This paper describes the use of product teardowns in an electronic systems cost modeling course at the University of Maryland. As part of a semester-long project, each student must choose a product with significant electronics content and determining the manufacturing cost of the product using a combination of top-down cost analysis (to determine what the product must cost) and a detailed bottoms-up model (that they calibrate using the top-down analysis). Products considered by students range from complex systems such as mobile phones to relatively simple systems such as memory sticks and MacDonald's Happy Meal® toys. Using product teardowns and reverse engineering ideas has proven to be an effective vehicle for educating students on practical manufacturing cost modeling of electronic systems.
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