Proceedings of the International Electronics Packaging Education Conference (at the Electronic Components and Technology Conference), May 30, 2006

Using Teardown Analysis as a Vehicle to Teach Electronic Systems Manufacturing Cost Modeling

P. Sandborn, J. Myers, T. Barron, and M. McCarthy
University of Maryland
College Park, MD 20742


This paper describes the use of product teardowns in an electronic systems cost modeling course at the University of Maryland.  As part of a semester-long project, each student must choose a product with significant electronics content and determining the manufacturing cost of the product using a combination of top-down cost analysis (to determine what the product must cost) and a detailed bottoms-up model (that they calibrate using the top-down analysis).  Products considered by students range from complex systems such as mobile phones to relatively simple systems such as memory sticks and MacDonald's Happy Meal® toys.  Using product teardowns and reverse engineering ideas has proven to be an effective vehicle for educating students on practical manufacturing cost modeling of electronic systems.

Complete article is available to CALCE Consortium Members.


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