Journal of SMTA, April 2006

Effect of Aging on Pull Strength of SnPb, SnAgCu and Mixed Solder Joints in Peripheral Surface Mount Components

A. Choubey, D. Menschow, S. Ganesan, and M. Pecht
University of Maryland
College Park, MD 20742


Global transition to Pb-free electronics has led component and equipment manufacturers to transform their SnPb process to Pb-free. At the same time, Pb-free legislation has granted exemptions to industries where alternatives to SnPb are not scientifically feasible or cost-effective. However, compatibility concerns can arise if Pb-free components have to be attached with SnPb solder. This paper discusses the effect of aging on the pull strength of pure SnPb, pure Pb-free and solder joints formed when Pb-free QFP components are attached with SnPb solder paste. Solder joint strength for quad flat pack (QFP) packages have been studied as a function of aging, circuit board pad finishes (Electroless Ni over Immersion Gold (ENIG), Immersion Silver (ImAg) and Immersion Tin (ImSn) and component lead finishes (Sn, Sn0.7Cu, Sn2Bi)

Complete article is available to CALCE Consortium Members.


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