S. Ganesan and M.G. Pecht
University of Maryland
College Park, MD 20742
Purpose - To present and discuss open trace defects uncovered in an FR4 assembly during electrical testing.
Design/methodology/approach - This paper presents open trace defects observed in FR4 assemblies and analyses the distribution of defects. The paper also discusses possible root causes for their occurrence.
Findings - The open trace defects that occurred during printed circuit board (PCB) fabrication should have been observed by the board manufacturer. It appears that the PCB manufacturer did not perform automatic optical inspection (AOI) and electrical testing during the manufacturing of the boards. The cost due to the rejected PCBAs was approximately 3x times that of the PCB cost.
Originality/value - The paper highlights the costly impact of uncovering a PCB defect after assembly. Based on the results of this study, the implementation of electrical testing and AOI for PCBs is recommended.
Complete article is available to CALCE Consortium Members.