Yuliang Deng and Michael Pecht
University of Maryland
College Park, MD 20742
A family of mold compounds with red phosphorus flame retardant was introduced as an environmental-friendly encapsulant for semiconductor devices. However, these mold compounds induced product failures, including current leakage and resistive shorts between adjacent leads within the package, and resistance increases and open circuits of the wire bonds. This paper presents the family of mold compounds with the red phosphorus flame retardant, the failure mechanisms and the root cause of the failures.
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