IASME Journal of Electronic Packaging, 2006

Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board

Sony Mathew
Diganta Das
Michael Osterman
Michael Pecht

Prognostics Health Management Group
Center for Advanced Life Cycle Engineering (CALCE)
Department of Mechanical Engineering
University of Maryland
College Park, MD 20742


This paper presents analysis of an unexpected failure during vibration and shock life test of an electronic circuit board that has been in use for more than 15 years. During testing, an aluminum bracket used to mount a transistor and provide a path for heat transfer was damaged. Prognostic methods were employed to determine whether the bracket failure could have been predicted prior to the life test. Details of the analytical calculations and modeling results are described in this paper. Results show that the failure could have been predicted before actual testing.

Complete article is available to CALCE Consortium Members.