6th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, pp. 695-702, EuroSimE, April 2005

Extending the Limits of Air-Cooling in Microelectronic Equipment

P. Rodgers, V. Eveloy, and M. Pecht
University of Maryland
College Park, MD 20742


Despite the perception that the limits of air-cooling have been reached, this paper reviews approaches that could maintain the effectiveness of this technology. Key thermal management areas that need to be addressed are discussed, including heat sink design and analysis, interface thermal resistance minimization, heat spreading, fan performance, hybrid thermal management, heat sink surface fouling, and sustainability.

Complete article is available to CALCE Consortium Members.


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