Abstract:

Temperature-humidity-bias (THB) testing is one accelerated test method for qualifying susceptibility of printed circuit board materials to electrochemical migration. This paper presents a comparative assessment of printed circuit board test structures processed using no-clean fluxes with eutectic tin-lead and tin-silver-copper alloys, as well as traditional rosin based flux with tin-silver solder alloy, on two different circuit card material, and subjected to various THB test conditions. The paper also provides results on short term response of surface insulation resistance to temperature and humidity.

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