38th International Symposium on Microelectronics, Flip Chip Reliability (Underfill, Cleaning, & Rework), pp. 367-375, Philadelphia, PA, September 25-29, 2005

Reliability Issues of No-Clean Flux Technology with Lead-free Solder Alloy for High Density Printed Circuit Boards

Sheng Zhan, Michael H. Azarian, and Michael Pecht
University of Maryland
College Park, MD 20742


Temperature-humidity-bias (THB) testing is one accelerated test method for qualifying susceptibility of printed circuit board materials to electrochemical migration. This paper presents a comparative assessment of printed circuit board test structures processed using no-clean fluxes with eutectic tin-lead and tin-silver-copper alloys, as well as traditional rosin based flux with tin-silver solder alloy, on two different circuit card material, and subjected to various THB test conditions. The paper also provides results on short term response of surface insulation resistance to temperature and humidity.

Complete article is available to CALCE Consortium Members.


[Home Page] [Articles Page]
Copyright © 2005 by CALCE and the University of Maryland, All Rights Reserved