Tong Fang, Michael Osterman, and Michael Pecht
University of Maryland
College Park, MD 20742
As the result of a global transition to Pb-free electronics, electronics parts manufacturers have switched to pure tin or high tin Pb-free alloy finishes. This change has prompted a reliability concern due to electrically conductive tin whiskers forming in pure tin or high tin alloy finished surfaces. However, the risk has not been quantified. This paper presents an algorithm to quantify tin bridging tin risk of failure from tin whiskers using a probabilistic approach. The algorithm employs statistical distributions to quantify whisker growth and Monte Carlo simulation to estimate failure risk. The goal of the algorithm is to provide a practical approach for electronic manufacturers to quantify the potential risks posed by tin whiskers.
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