Abstract:

To investigate the long term reliability of plastic ball grid array (PBGA) packages in aerospace application, accelerated tests were conducted to non-underfilled and underfilled packages under multimple environmental loadings at board level. This paper discusses the test results and the undefill effect on solder joint reliability. Failure mode and site were identified through failure analysis on test samples. To better understand the thermomechanical behavior of PBGA under cyclic thermal loading environments, three dimensional FEA models for non-underfilled and underfilled packages were also developed and used to predict the time to failure. over a wide range of frequencies. was Alpha Metals Staychip U1801.

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