Abstract:

New construction of fine pitch plastic ball grid array (FBGA) has been investigated through experimentation and physics of failure (PoF) analysis based on the reliability point of view. In this study, a three dimensional FEA model was developed to understand the thermomechanical behavior of FBGA under cyclic thermal loading environments. Experimental measurement was also carried out and the package warpage information was recorded by high-resolution digital CCD cameras with a 3-D image correlation method to validate this FEA model. The validated FEA model was used to calculate the inelastic strain of FBGA package that is related to the fatigue life of solder joint.

Keywords: FBGA, FEA, Warpage, Fatigue Life

Complete article is available to CALCE Consortium Members.

© IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.