2004 IEEE 20th Annual Semiconductor Thermal Measurement and Management, pp. 300-307, March 9-11, 2004

Simulation Model Development for Solder Joint Reliability for High Performance FBGA Assemblies

Haiyu Qi, Michael Osterman, and Mikyoung
University of Maryland
College Park, MD 20742

Kyujin Lee, and Seyong Oh
IPT Samsung Electronics
Giheungeup, Yongin, Gyeonggido, Korea

Tim Schmidt
Trilion Quality Systems
West Conshohocken, PA


New construction of fine pitch plastic ball grid array (FBGA) has been investigated through experimentation and physics of failure (PoF) analysis based on the reliability point of view. In this study, a three dimensional FEA model was developed to understand the thermomechanical behavior of FBGA under cyclic thermal loading environments. Experimental measurement was also carried out and the package warpage information was recorded by high-resolution digital CCD cameras with a 3-D image correlation method to validate this FEA model. The validated FEA model was used to calculate the inelastic strain of FBGA package that is related to the fatigue life of solder joint.

Keywords: FBGA, FEA, Warpage, Fatigue Life

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