IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging, pp. 211-214, Oct. 25-27, 2004

Miniaturized electromagnetic bandgap structures for ultra-wide band switching noise mitigation in high-speed printed circuit boards and packages

S. Shahparnia, O. Ramahi
University of Maryland
College Park, MD 20742


A novel design for electromagnetic bandgap structures embedded in packages is introduced. This design is able to mitigate switching noise in a power distribution network on an unprecedented range of frequencies, while having a very compact, miniaturized and practical structure.

Complete article is available to CALCE Consortium Members.

© IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.


[Home Page][Articles Page]