Circuit World, Vol. 30, No. 2, pp. 46-51, 2004

Assessing Lead-free Intellectual Property

Paul Casey and Michael Pecht
University of Maryland
College Park, MD 20742


This paper presents the analysis of information collected from numerous patent searches on lead-free alloys. The significance of claim structure and content is discussed in view of the growing number of lead-free patents. Patent analysis software was developed to effectively compare over 350 lead-free alloy patents. A case study was conducted to assess Sn-Ag-Cu and special purpose lead-free candidate alloy intellectual property. The results show that there are a number of patents and patent applications that may affect the use of "popular" Sn-Ag-Cu formulations.

Complete article is available to CALCE Consortium Members.


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