IEEE Transactions on Device and Materials Reliability, Vol. 3, No. 4, pp. 152-158, December 2003

Thermomechanical Analysis of Gold-Based SiC Die-Attach Assembly

Karumbu Meyyappan and Patrick McCluskey
CALCE Electronic Products and Systems Center
University of Maryland
College Park, MD 20742

LiangYu Chen
NASA Gleenn Research Center
Cleveland, OH


The thermomechanical stresses due to mismatch of the coefficients of thermal expansion (CTE) of the base material (SiC) and the packaging has a significant impact on the stresses in MEMS pressure sensors used in high-temperature applications, to 600 oC. The pressure sensor studied essentially consists of a SiC die attached to an AlN substrate using a gold die attach. Characterization of the stress distribution within the die attach, die and substrate along with the fatigue resistance of the die attach at 600 oC is essential to estimating the reliability of the packaging structure. A parametric study has been performed using nonlinear finite element analysis to optimize the die-attach thermomechanical performance at high temperatures. This study includes the effects of varying porosity levels and varying reference temperatures (stress-free temperature). This study also provides information about the mechanical deformations of the pressure sensor due to the thermomechanical load, which must be compensated, for the effective performance of the pressure sensor. The outcome of the study provides guidelines to optimize the design of the pressure sensor.

Complete article is available to CALCE Consortium Members.

© IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.


[Home Page] [Articles Page]
Copyright © 2008 by CALCE and the University of Maryland, All Rights Reserved