The Annual Reliability and Maintainability, 2003 Proceedings, pp. 313-318, Tampa Florida, January 27-30, 2003

Remaining Life Assessment of Aging Electronics in Avionic Applications

Ricky Valentin and Michael Osterman
CALCE Electronic Products and Systems Center
University of Maryland
College Park, MD 20742

Bob Newman
TRW Aeronautical Systems
Birmingham, UK


This paper describes an assessment of the remaining life of solder interconnects for 13 different insertion mount packages used in an engine control electronics. The assessment consisted of using simulation to determine the mean time to failure of solder joint interconnects between the package leads and printed wiring boards under applied temperature cycle conditions. The simulation results were confirmed by accelerated testing for a 132-Pin Grid Array (PGA) and field data for a 40-lead side- brazed Dual In line Package (DIP). Loading conditions include an accelerated test condition of 45o to 100oC and a service loading condition of 10o to 75oC with an extended dwell at 60oC. Predicted mean interconnect life expectancy ranged from 4,000 in the worst case to 130,000 cycles. Results indicate a brazed leaded ceramic dual inline package with 40 leads is likely to fail first and a 2 lead plastic encapsulated axial capacitor is the least likely to fail. The early failure of the 40-lead side-brazed DIP was confirmed by the service performance data. The service life remaining after failure of the 40-lead side-brazed DIP was estimated to be 7,800 cycles.

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