Mike Wood, Dennis Fritz, Dave Sawoska, and Frank Durso
MacDermid, Inc.
Waterbury, CT
L. Salzano and P. Sandborn
CALCE EPSC
University of Maryland
College Park, MD 20742
Abstract:
A number of technologies are being developed for embedding resistors inside printed circuit boards. One of the easiest methods for the board fabricator is using electroless plating to deposit the resistor composition additively, only where desired on traditional inner layers. This paper presents an update on the performance of this resistor composition in lamination, in thermal stress, and in moist environments. The design guidelines for using this composition are also presented.
Complete article is available to CALCE Consortium Members.