Society of Plastics Engineers Annual Technical Conference, pp. 1320-1324, Nashville, TN, May 4-8, 2003

Investigation of Packaging Properties as A Function of Filler Microstructures

Y. Huang, D. Bigio and M. Pecht
CALCE Electronic Products and Systems Center
University of Maryland
College Park, MD 20742


Fillers are used in the molding compounds to minimize the stress of electronic packaging by reducing the coefficient of thermal expansion (CTE) mismatch between the silicon die and the molding compounds. This study concentrates on the effect of filler particle spatial distribution. Quantitative measures of the particle distribution were experimental determined, including area fraction, size and interparticle distance (IPD). A 2?? ANOVA test was also conducted to assess the statistical significance of these variations of measures. The difference of filler volume fraction at different positions within one chip can be as big as 10%, and cause a CTE difference of about 4 ppm/C.

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