Qian Zhang, Abhijit Dasgupta and Peter Haswell
CALCE Electronic Products and Systems Center
University of Maryland
College Park, MD 20742
The creep resistance of Sn3.9Ag0.6Cu Pb-free solder alloy is compared to that of the baseline eutectic Sn37Pb solder at comparable homologous temperatures. Sn3.9Ag0.6Cu is significantly more creep-resistant than Sn37Pb solder. The isothermal cyclic mechanical durability of Sn3.5Ag and Sn3.9Ag0.6Cu Pb-free solder alloys are presented and compared to that of the baseline eutectic Sn37Pb solder at comparable homologous temperature. Cyclic mechanical tests are performed at high temperature at various strain-rates and load levels, using a thermo-mechanical-microstructural (TMM) test system developed by the authors. The data is analyzed using standard power-law durability models based on 50% load drop, using cyclic work and cyclic inelastic strain range. The durability curve of Sn3.9Ag0.6Cu Pb-free solder is found to have the largest slope, followed by the Sn3.5Ag solder and finally the baseline Sn37Pb eutectic solder, under the test conditions investigated. At a homologous temperature of 0.75, Sn3.9Ag0.6Cu shows the best durability, while Sn3.5Ag and Sn37Pb have very similar durability performance according to damage relations based on either work or inelastic strain range. The damage propagation rate is also estimated for all three solders, based on the load drop rate, and plotted vs. cyclic work and cyclic inelastic strain range.
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