Proceedings of the Fifth International Conference on Electronic Packaging Technology (ICEPT2003), pp. 36-39, Oct. 28-30, 2003

Computer Aided Reliability Assessment

J. Wang and M. Pecht
CALCE Electronic Products and Systems Center
University of Maryland
College Park, MD 20742

Jiaji Wang
Fudan University,
Shanghai, China

Abstract:

This paper will describe the structure and operation of integrated software tools being developed at the CALCE Electronic Products and Systems Center which facilitate design-for-reliability and virtual qualification of electronic systems at the component and circuit card level.

Complete article is available to CALCE Consortium Members.

 



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