SMTA International 2002, Donald Stephens Convention Center Rosemont, Illinois, Sept. 24-26, 2002

Underfilled PBGA Packages and Their Board Level Cycling and Vibration Performance

Thomas Baumann, Dave Humphrey, and Kevin Prodromides
Honeywell - Engine Systems and Accessories,
11100 N. Oracle Road,
Tucson, AZ 85737

Terry Burnette and Thomas Koschmieder
Motorola SPS,
MS: F25
3501 Ed Bluestein Blvd.
Austin, TX 78721

Jeff Kennedy and Jason Veum
Manufacturer' Services, LTD.
4300 Round Lake Rd.
Arden Hills, MN 55112

Haiyu Qi and Mike Osterman
University of Maryland
College Park, MD 20742


Original Equipment Manufacturers (OEM) who supply high reliability products to markets such as military, aerospace, and automotive are continually investigating methods to enhance the reliability of their proudcts utilizing "off the shelf" components and materials. An extensive DOE is underway to determine how assembly processes such as conformal coat and PBGA underfill can interact with PCB design parameters such as SMD vs. NSMD solder pads to provide enhanced solder joint reliability for products that require the greatest reliability achieveable. Board level temperature cycling and vibration testing will be performed to quantify the reliability improvements that can occur by implementing a BGA underfill process. Keywords: Vibration, BGA Underfill, Temperature Cycling, Solder Joint Reliability.

Complete article is available to CALCE Consortium Members.


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