Microelectronics Reliability, Vol. 42, No. 8, pp. 1163-1170, August, 2002

Characterization of Plastic Encapsulant Materials as a Baseline for Quality Assessment and Reliability Testing

L. Lantz, S. Hwang and M. Pecht,
University of Maryland
College Park, MD 20742


This paper discusses the assessment of chemical and physical properties of nine encapsulant materials and the tests which may be used to characterize the encapsulants and to confirm that the encapsulants are of consistent quality. The tests include glass transition temperature, coefficient of thermal expansion, filler content, moisture absorption, and ionic content.

Complete article is available to CALCE Consortium Members


[Home Page][Articles Page]