Experimental Techniques, Vol. 26, No. 3, pp. 25-29, May/June 2002

Observing Real-Time Thermal Deformations in Electronic Packaging

S. Cho, S. Cho and B. Han
CALCE Electronic Products and Systems Center
University of Maryland
College Park, MD 20742


A robust scheme of moire interferometry for real-time observation of thermal deformations was developed. It was implemented with a convection-type heating/cooling environ-mental chamber, which produced rapid temperature control. Vibrations caused by the environmental chamber were circumvented by rigid links that connected the specimen to the moire interferometer rather than supporting the specimen by the chamber. The result was exceptionally stable fringes. The system was utilized to document temperature-dependent behavior of a PBGA package assembly.

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