Transactions of the ASME, Vol. 124, pp. 292-297, September 2002

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling-Part I: Formulation

P. Sharmal and A. Dasgupta
University of Maryland
College Park, MD 20742


This paper presents a micro-mechanistic approach for modeling fatigue damage initiation due to cyclic creep in eutectic Pb-Sn solder. Damage mechanics due to cyclic creep is modeled with void nucleation, void growth, and void coalescence model based on microstructural stress fields. Micro-structural stress states are estimated under viscoplastic phenomena like grain boundary sliding, its blocking at second-phase particles, and diffusional creep relaxation. In Part II of this paper, the developed creep-fatigue damage model is quantified and parametric studies are provided to better illustrate the utility of the developed model.

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