IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 2, pp. 213-219, 2001

Thermal Characterization of a Liquid Cooled AlSiC Base Plate with Integral Pin Fins

K. Moores and Y. Joshi
CALCE Electronic Products and Systems Consortium
University of Maryland
College Park, MD 20742

G. Schiroky
dmc2 Electronic Components Inc.
Newark DE


In this study, we present the thermal analysis and experimental performance assessment of an aluminum silicon carbide (AlSiC) metal matrix composite (MMC) base plate with integral cooling fins. By attaching a pin-finned base plate to an open-chambered flow-through heat sink, the mechanical interface between the base plate and cooling medium is eliminated. This reduces the overall thermal resistance and improves module reliability as compared with traditional base plate cooling schemes. Computational fluid dynamics and heat transfer techniques were employed to model the thermal and hydrodynamic resistance characteristics through the pin fin structure of a prototype base plate design. A unit-cell approach was employed to avoid the computational expense of modeling the entire pin array. Performance was verified experimentally in a closed loop test facility using water as the cooling fluid. It was found that the unit-cell approach produced good agreement with experimental pressure drop and heat transfer results.

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