MST (Microsystems) News, pp. 41-42, September 2001
NASA Glenn Research
Cleveland, OH 44135
University of Maryland
College Park, MD 20742
Microsystems are increasingly being considered for high temperature applications, such as engine monitoring and space exploration. While MEMS devices exist to perform the needed functions, little attention has been paid to packaging them for harsh environments. This paper discusses the issues involved in high temperature packaging of microsystems, and describes a sample package.
Complete article is available to CALCE Consortium Members