MST (Microsystems) News, pp. 41-42, September 2001

Microsystem Packaging for High Temperature and Harsh Environments

Liang-Yu Chen
NASA Glenn Research
Cleveland, OH 44135

Patrick McCluskey
University of Maryland
College Park, MD 20742


Microsystems are increasingly being considered for high temperature applications, such as engine monitoring and space exploration. While MEMS devices exist to perform the needed functions, little attention has been paid to packaging them for harsh environments. This paper discusses the issues involved in high temperature packaging of microsystems, and describes a sample package.

Complete article is available to CALCE Consortium Members


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