Paper N2.1, MRS Proceedings, Vol. 682E, MRS Spring Symposium on Microelectronics and Microsystems Packaging; Editors: Boudreaux, Dauskardt, Last, and McCluskey, Chicago, 2001.

Microthermomechanical Analysis of Lead-Free Sn3.9Ag0.6Cu Alloys; Part I: Viscoplastic Constitutive Properties; and Part II: Cyclic Durability Properties

Haswell,P. and Dasgupta, A.,


This is part I of a two-part paper on the mechanical behavior of lead-free solders. The constitutive properties of Sn3.9Ag0.6Cu lead-free alloy are presented and compared against baseline data from eutectic Sn63Pb37 solder. Monotonic, displacement-controlled and load-controlled tests are performed over various temperatures, strain rates and stresses using the thermo-mechanical-microstructural (TMM) test system. It is shown that the lead-free alloy exhibits creep strain rates that are from one to five orders of magnitude lower than the eutectic SnPb alloy, depending on the stress level and the homologous temperature.

Complete article is available to CALCE Consortium Members

[Home Page][Articles Page]