IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 4, pp. 721-728, December 2001
Boeing Commercial Airplane Group
National Semiconductor Corporation
Santa Clara, CA
Diganta Das, and Michael Pecht
University of Maryland
College Park, MD
When assessing the suitability of active electronic parts for use over a temperature range outside the manufacturer specified range, some manufacturers use a limiting value of junction temperature to define the maximum allowable thermal stress applied to the die. This process of thermal uprating based on junction temperature includes the following steps:
This approach to junction temperature based thermal uprating is appealing, because it offers the opportunity to avoid expensive and time-consuming part level electrical tests; however, the process may be more complicated than it appears.
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