Future Circuits International, Issue No. 7, pp. 45-49, 2001

High Performance Packaging Materials for Improved Thermal Management of Power Electronics

K. Moores and Y. Joshi
CALCE Electronic Products and Systems Consortium
University of Maryland
College Park, MD 20742


Power semiconductor devices, which function to block and thereby control the flow of current, are being applied to a larger selection of applications from motor control to lighting to reduce overall system power consumption. At the same time, the inability to efficiently remove heat from power semiconductor packages has become a principal barrier to extending the voltage and current handling capability of high capacity modules. However, use of engineered metal matrix composites and other high performance packaging materials provides the potential to significantly mitigate existing thermal limitations.

Complete article is available to CALCE Consortium Members


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