International Journal of Damage Mechanics, Vol. 10, pp. 101-132, April 2001

Micro-Mechanics of Fatigue Damage in Pb-Sn Solder Due to Vibration and Thermal Cycling

A. Dasgupta, P. Sharma and K. Upadhyayula
CALCE Electronic Products and Systems Consortium
University of Maryland
College Park, MD 20742


This paper presents a micro-mechanistic approach for modeling fatigue damage initiation due to cyclic plasticity and cyclic creep in eutectic Pb-Sn solder. The issue of damage evolution is deferred to a future paper. Fatigue damage model due to cyclic plasticity is modeled with dislocation mechanics. A conceptual framework is provided to quantify the influence of temperature on fatigue damage due to cyclic plasticity. Damage mechanics due to cyclic creep is modeled with a void nucleation model based on micro-structural stress field. Micro-structural stress states are estimated under viscoplastic phenomena like grain boundary sliding and its blocking at second phase particles, and diffusional creep relaxation. A conceptual framework is provided to quantify the creep-fatigue damage due to thermo-mechanical cycling.

Complete article is available to CALCE Consortium Members


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