Proceedings of the 7th Intersociety Conference on Thermal and Thermomechanical Phenomenon in Electronic Systems (I-Therm), Las Vegas, NV, May 2000.

Single Chamber Compact Thermosyphons with Micro-Fabricated Components

S. Murthy, Y. Joshi and W. Nakayama,
CALCE Electronic Products and Systems Consortium
University of Maryland
College Park, MD 20742


This study presents the thermal performance evaluation of a compact single-chamber thermosyphon. The thermosyphon set-up has a central evaporator section with integrated fins for cooling along the edges. The evaporator employs a micro-fabricated three-dimensional copper structure for enhancing boiling heat transfer. The thermal performance of the system was characterized at various power levels and condenser cooling conditions. The size of the boiling enhancement structure and effects of liquid fill volumes on performance were also investigated. Incorporation of the enhancement structure resulted in an improvement in the thermosyphon performance by decreasing the wall temperature at the evaporator by 8 oC, for a power dissipation of 36 W/cm2 at an air speed of 1 m/s. The maximum heat flux obtained based on a maximum evaporator temperature of 75 oC for an air speed of 1 m/s was 42.5 W/cm2 . Variation in the liquid fill volume showed negligible effect on the maximum temperature at the evaporator, as long as the enhanced structure was fully flooded. Increasing the footprint size of the enhancement structure showed marginal improvement in boiling heat transfer performance. Thus increasing the number of pores in the enhancement structures did not result in a corresponding increase in the performance.

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