34th National Heat Transfer COnference Pittsburgh, NHTC 2000-12197, Pennsylvania, August 20-22, 2000

Thermal Management of High Temperature Pulsed Electronics Using Phase Change Materials

S. Gurrum, Y. Joshi and J. Kim
CALCE Electronic Products and Systems Consortium
University of Maryland
College Park, MD 20742


A computational feasibility study of using solid-liquid Phase Change Materials (PCMs)for periodic power dissipating devices is reported. Thermal enhancement has been studied with PCM enclosed inside microchannels within the semiconductor devices. PCMs perform well at lower power levels for silicon carbide devices but the use of high thermal conductivity spreaders become mandatory at higher power levels. PCM effectiveness and temperature reductions as a function of die thickness, channel width and power dissipated is presented. Temperature reductions up to 25 oC can be realized with a combination of diamond spreaders and PCM filled microchannels.

Complete article is available to CALCE Consortium Members


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