Journal of Electronic Packaging, Transaction of the ASME, Vol. 122, No. 3, pp. 294-300, 2000

Moire Interferometry for Engineering Mechanics: Current Practices and Future Developments

D. Post
Department of Engineering Science and Mechanics
Virginia Polytechnic Institute and State University
Blacksburg, Virginia

P. Ifju
Aerospace Engineering, Mechanics and Engineering Science
University of Florida

Bongate Han
CALCE Electronic Products and Systems Center
University of Maryland
College Park, MD 20742


In the past decade, the optical method called moire interferometry has matured rapidly to emerge as an invaluable tool, proved by many industrial and scientific applications. It has been applied to numerous problems in engineering mechanics. It measures in-plane displacement fields with high sensitivity and high spatial resolution. This paper reviews current practices of moire interferometry and its extensions. Diverse applications are referenced to emphasize the wide scope of the method in engineering mechanics. Examples in the text are from the microelectronics industry, where moir?interferometry is used extensively for experimental analyses of temperature-induced deformations. In-depth speculation on future developments and practices is presented.

Complete article is available to CALCE Consortium Members.


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