Abstract:

In the past decade, the optical method called moire interferometry has matured rapidly to emerge as an invaluable tool, proved by many industrial and scientific applications. It has been applied to numerous problems in engineering mechanics. It measures in-plane displacement fields with high sensitivity and high spatial resolution. This paper reviews current practices of moire interferometry and its extensions. Diverse applications are referenced to emphasize the wide scope of the method in engineering mechanics. Examples in the text are from the microelectronics industry, where moir?interferometry is used extensively for experimental analyses of temperature-induced deformations. In-depth speculation on future developments and practices is presented.

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