IEEE Transactions on Components and Packaging Technology,
Vol. 22, No. 3, pp. 355-356, September 1999.

Terminology for Use of Parts Outside Manufacturer-Specified Temperature Ranges

Lloyd Condra, Richard Hoad, David Humphrey, Thomas Brennom, John Fink, Joel Heebink, Chris Wilkinson, David Marlborough, Diganta Das, Neeraj Pends?and Michael Pecht


Precise, unambiguous and common terms associated with semiconductor part use outside manufacturer?specified temperature range are needed for three reasons. The first reason is for the manufacturers, equipment suppliers, and customers to understand the methods, the intent and the processes involved in the engineering and business decisions made when considering the use of semiconductor parts outside manufacturer-specified temperature ranges.

The second reason is the need for communications across the supply chain. The entire supply chain, including those involved in assessing the semiconductor parts for use outside the manufacturer-specified temperature range, users of the end products, and the regulators for those products, must communicate in the same "language."

The third reason for the terminology is legal clarity. Several semiconductor manufacturers have cautioned against any use of semiconductor parts beyond their published operating conditions, and the Semiconductor Industry Association has warned of potential legal implications. Terms and methods for use of semiconductor parts outside manufacturer-specified temperature ranges may be subject to legal examination; the definitions used by the industry should be able to withstand legal scrutiny. related to the use of semiconductor parts outside manufacturer-specified temperature range represent a consensus among various sectors of the electronics industry.

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