Circuit World , Vol. 25, (3), pp. 28-38, 1999.

Solder Failure Mechanisms in Single-Sided Insertion-Mount Printed Wiring Boards

C. Hillman, K. Rogers, A. Dasgupta, and M. Pecht
CALCE Electronic Products and Systems Consortium, University of Maryland, College Park, MD
R. Dusek and B. Lorence
General Motors Truck Group, General Motors, Pontiac, MI


This paper presents the defects that occur during the assembly and manufacturing of solder joints in single-sided insertion-mount printed wiring boards (PWBs). Each type of defect is discussed, with particular focus on how these defects are related to solderability issues, the mechanisms of failure due to defect-induced failure accelerators, and the effect of the defect on solder joint reliability.

Keywords: solder, failure accelerators, defects, reliability, singled-sided CEM printed wiring board, energy-partitioning model

Complete article is available to CALCE Consortium Members.

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